Defendant: QualcommInc. and Qualcomm Technologies Inc.
A patent infringement case (8:13-cv-00482) was filed by Chip Packaging Solutions against Qualcomm on Mar 26 in the California Central District Court. The patent involved in this suit is US5838072 entitled ‘Intrachip power distribution package and method for semiconductors having a supply node electrically interconnected with one or more intermediate nodes’ was issued on Nov 17, 1998 and expires[i] on Feb 24, 2017. The patent is currently assigned[ii] to Patent Business Development (source: MaxVal’s Assignment Database).
The '072 patent relates to a structure of an integrated circuit package that is comprised of a semiconductor die, a supply node electrically connected to a power source, intermediate nodes, and respective conductive leads lying external to and within the periphery of the die.
As per the complaint, CPS is the exclusive and current owner of the patent. CPS alleges that Qualcomm manufactures products and systems comprising semiconductor chip packages including Qualcomm MDM8220 Multi Chip Package Mobile Data Modem that embody the claims covered in ‘072 patent.
On the same day, CPS has filed other cases asserting the same patent against the following companies: