Semcon Tech, a Texas-based company filed two patent infringement cases in Apr 2012 and Feb 2013 claiming that their patents were infringed. The patents involved in the two cases were:
US7156717 – Situ finishing aid control was issued on Jan 02, 2007 and expires* by Sep 20, 2021.
US6656023 – In situ control with lubricant and tracking was issued on Dec 02, 2003 and expires* by Nov 05, 2019.
The patents are currently assigned+ to Semcon Tech (source: MaxVal’s Assignment Database). Plaintiff alleged that Samsung manufactures integrated circuits that are fabricated using a process of chemical-mechanical polishing (CMP) with the use of an Ebara F-REX 300 CMP system andApplied Materials Reflexion CMP system with a fixed abrasive pad that claimed by the ‘717 and ‘023 patents. The lawsuits do not specifically mention any products of the defendant that allegedly violate the patents. Semcon sought a judgment in favor and all other relief to which the Court may deem the plaintiff be entitled.
The parties on Jun 26 reported to Court that they have settled the dispute amongst themselves and filed dismissal for both the cases. Upon consideration, the Judge ordered the case dismissed with prejudice, with each party to bear their own costs and expenses. Terms of settlement were not disclosed.
Semcon Tech has also filed patent infringement suits against several chip makers, including IBM, Intel, Fujifilm electronics, Texas Instruments and Micron. IBM settled the case with Semcon recently on Jun 16.
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*Expected expiration date.Patent Term Estimatoris a free web-based tool that automatically calculates patent terms and expiration dates for U.S. utility patents +MaxValoffers Patent Assignment Alert service where subscribers receive email alerts when assignments relating to target applications, patents or entities of interest are recorded.