A patent infringement case was filed by Semcon against IBM claiming that their patents were infringed. The patents involved in this suit are:
US6541381- Finishing method for semiconductor wafers using a lubricating boundary layer, issued inApr 01, 2003
US6656023- In situ control with lubricant and tracking, issued inDec 02, 2003
The patents expire by Nov 05, 2019 and are currently assigned to Semcon Tech (source: MaxVal’sAssignment Database). Plaintiff alleged that defendant manufactures integrated circuits that are fabricated using a process of chemical-mechanical polishing (CMP) with the use of an Ebara F-REX 300 CMP system andApplied Materials Reflexion LK CMP system with a fixed abrasive pad that are patented under the ‘381 and ‘023 patents. Semcon sought a judgment in favor and all other relief to which the Court may deem the plaintiff be entitled.
The proceedings were ongoing and on Jun 7, the parties having reached an agreement, filed joint motion to dismiss. Following the dismissal filed, Judge Richard G. Andrews ordered claims and counterclaims asserted in the case be dismissed with prejudice and each party to bear the costs and expenses incurred.